OLIX - Senior Packaging Engineer

• Own package design activities for ASIC-to-substrate integration, including bump/pad mapping, substrate escape, interconnect strategy, package floorplanning, and stack-up definition • Lead the development of 2.5D and 3D package architectures, including multi-die integration, chiplet-style interfaces, and heterogeneous integration approaches • Define package structures that meet electrical, thermal, mechanical, reliability, and manufacturability requirements • Translate silicon and system requirements into practical package design rules, routing constraints, and implementation strategies • Drive package technology selection based on performance, risk, manufacturability, cost, and scalability • Own or lead the full package design flow, from concept definition through detailed design, analysis, layout, verification, release, and manufacturing support • Develop and review package layouts including die placement, substrate routing, power/ground distribution, high-speed interface breakout, and physical integration constraints • Own and execute PI/SI simulation activities to validate signal integrity, power delivery, and package performance, translating results directly into design improvements and sign-off decisions • Support package-to-board co-design, including substrate layout and PCB layout/interface definition where required • Ensure strong alignment between die, package, substrate, and board-level implementation • Oversee package database management, design reviews, sign-off, and release readiness • Tools, Methods & Implementation • Use package design tools such as Cadence Allegro X APD, or equivalent to develop and maintain advanced package and substrate layouts • Establish and improve package design libraries, templates, rules, and workflows to support efficient and repeatable development • Drive layout reviews, implementation checks, and sign-off processes to ensure package integrity and compliance with technology and manufacturing constraints • Support tool flow development and integration across package, substrate, simulation, and PCB environments • Ensure robust design data handoff to substrate vendors, OSATs, and manufacturing partners • Cross-Functional Engineering • Work closely with ASIC, mechanical, thermal, and systems engineers to optimise package performance and system integration • Collaborate with substrate vendors, OSATs, foundries, and external partners on stack-ups, design rules, implementation feasibility, and manufacturing readiness • Lead packaging input into architecture reviews, risk assessments, and development planning • Ensure package design decisions support broader product requirements including manufacturability, reliability, serviceability, and scale • Act as the key interface between package design and adjacent engineering domains • Manufacturing & Productisation Support • Ensure package designs are aligned with assembly, qualification, reliability, and manufacturing requirements • Lead DFM/DFX activities for advanced package technologies and substrate implementations • Support prototype build, bring-up, qualification, and early production with strong technical ownership of packaging-related issues • Participate in root cause analysis and corrective action for packaging or integration issues identified during build, test, or reliability assessment • Review substrate deliverables, fabrication outputs, and manufacturing documentation for completeness and technical quality • Competitive Salary: £109,000+ commensurate with your experience, skills, and location. • Equity & Ownership: Meaningful stock options. You’re not just joining the mission; you’re owning a piece of it. • Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer a £24k annual Living-Local Bonus if your residence is within 20 minutes of the office. • Health & Wellbeing • Health & Wellbeing • Premium Healthcare: Comprehensive BUPA medical and dental cover, including Medical History Disregarded (MHD), for complete peace of mind. • Time Off: 25 days of annual leave, plus all UK bank holidays. • The Workspace & Tech • Elite Hardware: M4 Macs come as standard, with M4 Pro upgrades for our engineering team. We will provide whatever you need to do your best work. • Optimal Environment: High-spec noise-cancelling headphones and a fully ergonomic workstation designed for deep focus. • Rapid Prototyping: Access to our high-performance 3D printing lab for work, experimentation, and personal creative projects. • Life at the Office • Life at the Office • Chef-prepared meals: if you need to work late. • Caffeine on Us: We’ve got you covered with a tab at our favourite local coffee shop. • Relocation & Global Mobility • Visa Sponsorship: We hire the best in the world. We offer full UK and international visa sponsorship. • Seamless Relocation: Whether you’re moving across the country or across the globe, our dedicated relocation partner provides funding and concierge support to get you settled. • Due to U.S. export control regulations, candidates’ eligibility to work at OLIX depends on their most recent citizenship or permanent residency status. We are generally unable to consider applicants whose most recent citizenship or permanent residence is in certain restricted countries (currently including Iran, North Korea, Syria, Cuba, Russia, Belarus, China, Hong Kong, Macau, and Venezuela). Applicants who have subsequently obtained citizenship or permanent residency in another country not subject to these restrictions may still be eligible.