olix - Staff Optical Engineer – Optical Interconnect & Optical Communications

• Optical Interconnect & CPO Architecture • Define high-bandwidth optical interconnect systems spanning 1. In-tray (chip-to-chip), 2. Intra-tray, and 3. Rack-to-rack links. • Contribute to co-packaged optics (CPO) architectures integrating photonics intimately to high-performance ASICs for optimized latency and connectivity. • Develop scalable link strategies across fiber, integrated waveguides, and planar-light-wave circuits (PLC) • Own system-level link budgets including insertion loss, coupling loss, bandwidth, BER, power, and thermal margins and requirements for lasers and receivers. • Balance bandwidth density, power consumption, reliability, and serviceability constraints. • Collaborate closely with opto-mechanical, ASIC, mixed-signal, RF, and DSP teams on electro-optic interface definitions • Participate in co-optimization of Modulation formats, Equalization strategies, Laser integration approaches, Driver and Receiver architectures • Contribute to system modeling across high-speed VCSELs, optics, detectors, electrical channels, packaging, and signal processing layers • Analyze trade-offs between optical reach, power budget, and electronic complexity • Familiar with state-of-the art rapid optical prototyping tools, especially as it pertains to PLCs and micro-optics. • Fiber, Waveguides & PLC Systems • Design and optimize high-density fiber-optic interconnects • Develop and analyze integrated waveguide-based links • Design Planar Lightwave Circuits (PLC) for routing, splitting, tapping, multiplexing, in/out coupling, and signal distribution. • Optimize fiber-to-waveguide and fiber-to-package coupling strategies for both multimode and single mode waveguides. • Address packaging constraints including alignment tolerances and connector strategies • CPO Packaging, Thermal & Reliability Considerations • Contribute to on-package and near-package photonic integration strategies • Evaluate thermal interactions between ASICs and photonic devices • Address serviceability, repairability, and field-replaceability trade-offs in CPO architectures • Drive tolerance and reliability analysis for high-density optical packaging • Partner with mechanical and thermal teams to ensure robust system integration • High-Speed Validation & Production Readiness • Define validation strategies for Tbps-class optical links based on various multiplexing schemes (spatial, wavelength, modulation) • Analyze insertion loss, return loss, crosstalk, bandwidth, and noise performance • Correlate system simulations with lab and pre-production results • Drive Design for Manufacturing (DFM) for co-packaged and high-density optical assemblies • Support pilot builds and production ramp, resolving yield and variability issues