lumilens - Silicon Photonic Engineer (CPO)
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Requirements
• Advanced degree (MS or PhD) in Electrical Engineering, Electrical & Computer Engineering, or a related field. • Strong foundation in silicon photonics device design, optical interconnect concepts, and photonic integration. • Experience with process integration, backend assembly techniques, or advanced packaging for photonic systems. • Familiarity with transitioning photonic technologies from development into production environments. • Hands‑on exposure to device design, cleanroom fabrication, and photonic device testing or characterization. • Ability to collaborate effectively across multidisciplinary teams and communicate complex technical topics clearly. • Strong analytical and problem‑solving skills, with a track record of delivering results in fast‑moving environments. • Background in CPO architectures, high‑speed optical interconnects, or photonic packaging solutions. • Experience contributing to or developing PDKs for silicon photonics platforms. • Exposure to backend processes such as Cu bumping, laser diode attach, TSV, or fiber‑related assembly. • Prior involvement in customer‑driven development programs or industry collaborations. • Publications, patents, or recognized contributions in silicon photonics or related fields.
Responsibilities
• Develop and optimize silicon photonic devices and building blocks for CPO‑focused platforms, ensuring strong performance and manufacturability. • Contribute to the creation and refinement of process integration flows, including backend and advanced packaging steps essential for photonic assembly. • Support the evolution of PDK components and design rules, enabling reliable, high‑volume production. • Partner with cross‑functional teams—spanning R&D, fabrication, reliability, product engineering, and customer‑facing groups—to align technical requirements and deliverables. • Guide products through the full lifecycle from early development and NPI through qualification and ramp‑to‑production. • Investigate device or process issues through structured analysis, driving corrective actions and long‑term improvements. • Participate in customer and partner engagements, offering technical insights that accelerate design cycles and improve manufacturability. • Contribute to continuous improvement initiatives that enhance yield, streamline processes, and strengthen platform capability.
Benefits
• Competitive salary commensurate with experience • Comprehensive benefits package including health insurance • Professional development opportunities and certification support • Access to cutting-edge photonics technology and advanced packaging environments • Collaborative work environment with cross-functional teams solving complex engineering challenges
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