lumilens - Die Attach Manufacturing Engineer- Process & Equiment
Requirements
• Bachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or related field (Master's preferred for senior roles) • 3–7 years of hands-on experience in silicon photonics/PIC industry, focusing on die attach process/equipment engineering for optical or opto-electronic packaging • Direct experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement • Working knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes (coupling loss, epoxy haze, bond-line drift, facet damage) • Experience with high-precision die/fiber attach equipment (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or equivalent) • Familiarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone) for optical coupling yield and alignment accuracy • Understanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration) and their die attach/alignment needs • Strong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances • Ability to read/interpret optical/mechanical engineering drawings, specs, and manuals • Experience in high-volume silicon photonics, optical transceiver, or PIC foundry/packaging house • Exposure to active alignment and optical feedback-based die bonding (real-time power monitoring) • Experience with hermetic packaging, TECs, and laser die attach for telecom/datacom optics • Six Sigma Green/Black Belt certification • Experience with statistical software (Minitab, JMP) and MES/data systems • Familiarity with automation/robotics for sub-micron precision assembly • Strong problem-solving and root cause analysis mindset • Hands-on, equipment-floor-ready with willingness to work on production lines • Effective cross-functional communication and documentation skills • Project management to drive NPI timelines and equipment installs • Comfortable in a fast-paced, metrics-driven manufacturing environment • Ability to work flexible shifts or support production as needed • PHYSICAL/WORK ENVIRONMENT • Cleanroom/manufacturing floor environment; gowning may be required • Ability to stand for extended periods and work near production equipment • Occasional travel to supplier/equipment vendor sites for tool evaluation/training
Responsibilities
• PROCESS ENGINEERING • Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding. • Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy. • Lead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control). • Support NPI by developing die attach process flows for new photonic packages, transceiver modules, and hybrid/co-packaged integration platforms. • Monitor SPC/process capability (Cpk) data on placement accuracy, bond-line thickness, and optical coupling efficiency. Drive process improvements to reduce variation and coupling loss. • Evaluate and qualify optically-compatible die attach materials (low-outgassing/UV-cure epoxies, index-matched adhesives, AuSn solder) with Materials and Optical Design Engineering. • Partner with Quality, Reliability, and Product/Optical Engineering on failure analysis and reliability testing (thermal cycling, humidity, optical power/coupling loss, hermeticity, shear/pull testing, X-ray/CSAM/SAT inspection). • Support development of active alignment processes with real-time optical feedback during die bonding. • EQUIPMENT ENGINEERING • Own equipment performance, uptime, and OEE for photonics die attach tools (high-precision active/passive alignment die bonders, sub-micron pick-and-place, epoxy dispense, AuSn/eutectic die bonders, UV-cure stations, fiber/waveguide alignment). • Lead equipment installation, qualification (IQ/OQ/PQ), and ramp-up for new/upgraded photonic die bonding and alignment tools, including vision systems and sub-micron motion stages. • Maintain and execute preventive maintenance plans, troubleshoot high-precision optical/mechanical equipment (stage drift, calibration, repeatability), and minimize downtime. • Work with specialized vendors (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or similar) for tool upgrades, retrofits, spare parts, and technical escalations. • Drive automation, tooling, and fixture improvements for throughput and repeatability while maintaining alignment tolerances and protecting optical facets/lenses. • Support equipment capacity planning and capital equipment (CAPEX) proposals. • CROSS-FUNCTIONAL COLLABORATION • Collaborate with Design, Product, Quality, and Operations teams to align die attach process capability with product requirements. • Provide technical training and guidance to manufacturing technicians and operators. • Support process/equipment documentation for internal and customer audits. • Track and report KPIs: yield, Cpk, equipment uptime, scrap rate, and cycle time. • Engage in cost reduction, lean manufacturing, and Six Sigma/continuous improvement initiatives.
Benefits
• Competitive salary and benefits package • Work on cutting-edge photonics packaging technology • Collaborative, cross-functional engineering environment • Career growth within process/manufacturing engineering
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