lumilens - Wire Bond-Manufacturing Engineer
Requirements
• Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering • 3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM) • Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes • Experience with DOE, SPC, and root cause/CAPA methods • Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond) • Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883) • Strong analytical, troubleshooting, and cross-functional communication skills • Willingness to support shift or production floor needs • Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging • Exposure to copper wire bonding and associated process/reliability considerations • Experience with fine-pitch wire bonding (
Responsibilities
• Process Engineering • Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems • Establish and maintain process specifications, bond recipes, work instructions, and control plans • Lead root cause analysis and corrective/preventive actions (CAPA) for wire bond process yield losses and defects • Support NPI by developing new wire bond process flows, including DOE-driven process windows • Perform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC) • Drive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving • Equipment Engineering • Own the uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.) • Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH (units per hour) • Lead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders • Collaborate with equipment vendors for technical escalations and upgrades • Plan preventive maintenance and spare parts strategy • Quality & Reliability • Partner with Quality and Reliability teams on failure analysis for field and customer returns • Support qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions • Ensure compliance with IPC/JEDEC standards and customer requirements • Cross-Functional Collaboration • Work closely with Product/Design Engineering for bond pad layout and substrate design • Partner with Process Integration, Test, and Quality to resolve yield and reliability issues • Support cost reduction initiatives and train operators/technicians on process and equipment • Documentation & Compliance • Maintain process control documents, FMEAs, control plans, and traceability as per Lumilens quality management systems (ISO 9001 / IATF 16949 / AS9100) • Support internal and customer audits related to wire bond processes and equipment
Apply in one click
Upload My Resume
Drop here or click to browse · Tap to choose · PDF, DOCX, DOC, RTF, TXT