olix - Optical Interconnect Process Engineer
Requirements
• 5–15 years of experience in advanced micro-fabrication, with deep process integration expertise specifically in Thin Film Lithium Niobate (TFLN / LNOI) or compound semiconductor (InP, GaAs) optoelectronics. • Proven track record of creating or modifying complete process flows for high-speed active electro-optic devices. • Deep hands-on background in physical etching tech required for LN (such as chlorine/fluorine ICP-RIE, ion milling) as well as advanced PECVD/ALD cladding, and metal deposition.
Responsibilities
• Optical Interconnect Implementation • Design and optimize ultra-high-speed TFLN active components. • Develop efficient coupling solutions, such as spot-size converters and specialized edge-coupling to transition light efficiently from laser sources and fibers into TFLN waveguides. • Integrate high-frequency (100 GHz+) traveling-wave RF electrodes, optimizing for velocity and impedance matching between the electrical and optical signals. • Define alignment strategies and sub-micron tolerances for high-volume automated assembly of active optical sub-assemblies. • Packaging & Integration • Drive co-packaged optics (CPO) integration utilizing active TFLN platforms. • Address complex opto-electronic constraints, managing the co-packaging of high-speed RF driver ICs (EIC) directly with TFLN PICs. • Partner with mechanical and thermal teams to mitigate the anisotropic thermal expansion, pyroelectric effects, and mechanical stress inherent to Lithium Niobate crystals. • Process Development & Manufacturing • Develop and refine wafer-scale fabrication processes for LNOI substrates, focusing on high-quality thin-film morphology and cladding layer deposition. • Optimize difficult dry-etching processes (e.g., Ar+ ion milling, ICP-RIE physical sputtering) to achieve highly anisotropic, smooth waveguide sidewalls with minimal redeposition. • Establish robust metallization processes (liftoff, electroplating) for thick, low-loss Cu/Au RF electrodes. • Partner with specialized photonics foundries and OSATs to transfer, stabilize, and scale TFLN process flows from R&D to production. • Yield, Reliability & Validation • Mitigate DC bias drift and pyroelectric charge accumulation through advanced layer engineering, passivation, and surface treatments. • Analyze process variability affecting waveguide geometry, uniformity, and optical insertion loss across 200mm/300mm wafers. • Define and execute validation plans for integrated TFLN assemblies, ensuring long-term electro-optic reliability and high optical power handling.
Benefits
• Competitive Salary: Commensurate with your experience, skills, and location • Equity & Ownership: Meaningful stock options. You’re not just joining the mission; you’re owning a piece of it • Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office • Retirement Benefits: Employer-contributed retirement plans to help you build long-term financial security. • Due to U.S. export control regulations, candidates’ eligibility to work at OLIX depends on their most recent citizenship or permanent residency status. We are generally unable to consider applicants whose most recent citizenship or permanent residence is in certain restricted countries (currently including Iran, North Korea, Syria, Cuba, Russia, Belarus, China, Hong Kong, Macau, and Venezuela). Applicants who have subsequently obtained citizenship or permanent residency in another country not subject to these restrictions may still be eligible.
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