Vinci4d - Principal Thermal-Mechanical Engineer
Requirements
• Degree in Mechanical, Electrical, or related engineering field • 15+ years of hands-on thermal management, mechanical warpage, stress and reliability using commercial software such as Flowthem, Cadence, Ansys, Abaqus, LS Dyna, etc. • Strong communication and interpersonal skills. • Prior managerial or leadership experience • managerial • leadership • Prior experience in customer-facing roles • customer • facing • Strong problem-solving mindset and ability to quickly learn new tools and workflows • Strong ability to communicate complex results clearly to a mixed audience (technical + business) • Familiarity with semiconductor electronics packaging, advanced packaging or foundry (chip warpage, wafer warpage, 2.5D/3D IC, etc.) • Experience in pre-sales, technical sales, or customer-facing engineering roles • Ability to rapidly learn and adapt to new physics-based workflows and AI-assisted design tools • Experience with commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies
Responsibilities
• Build, lead, and scale a high-performing team of thermal and thermo-mechanical engineers, setting technical direction, mentoring team members, and driving execution. • Engage with customer engineering teams during the evaluation phase by supporting simulation setup, running test cases, and interpreting results to demonstrate Vinci’s value. • Collaborate with the sales team to deliver product demonstrations, conduct proof-of-concept evaluations, and participate in in-depth technical discussions with prospective customers. • Support customer onboarding and deployments by providing technical guidance, training, and troubleshooting throughout the deployment and production phases. • Identify customer pain points and workflow challenges, and collaborate with the product and engineering teams to improve product capabilities and overall customer experience. • Deliver technical training sessions and workshops to enable customer teams to effectively adopt and scale Vinci within their engineering workflows. • Represent Vinci at industry conferences and semiconductor events by delivering live product demonstrations, managing booth activities, and engaging technically with prospective customers and partners. • Maintain a strong understanding of competitive technologies, industry trends, and market positioning to effectively communicate Vinci’s differentiators.
Benefits
• We are building Physics AI for hardware design. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows. • By bridging the gap between traditional simulation and machine learning, we are redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems. • Be part of a team defining the future of AI in hardware design. • Work at the intersection of advanced AI, real-world engineering, and customer success. • Collaborate with world-class engineers and researchers in a fast-moving startup environment.
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