lumilens - Senior Manager, Silicon Photonics Testing and Packaging

Singapore1w ago

In Office Senior APAC Semiconductors Software Senior Community Manager Senior Product Manager Fiber Cross-functional Collaboration Stakeholder Management Documentation

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Photonics, materials, or a related field • Minimum 10 years of experience in photonics test/packaging engineering, with at least 5 years in a managerial or leadership capacity • Proven track record in NPI, test solution development, and HVM transfer within the photonics industry • Strong understanding of silicon photonics packaging and test processes (e.g., optical alignment, wafer-level/final test, wire bonding, or fiber attach) • Experience managing tester RFQ processes and vendor negotiations • Strong project management, cross-functional collaboration, and stakeholder management skills • Excellent leadership and people management capabilities

Responsibilities

• Lead the New Product Introduction (NPI) effort to develop in-house test solutions, including managing the tester RFQ (Request for Quotation) process • Own the transfer of qualified test solutions into High Volume Manufacturing (HVM), ensuring smooth handover and production readiness • Partner with design, process, and packaging engineering teams to define test requirements and specifications for silicon photonics products • Evaluate, select, and manage relationships with test equipment vendors and suppliers • Drive test yield improvement and cost-of-test reduction initiatives across the product lifecycle • Establish and maintain test methodologies, standards, and documentation to support scale-up and manufacturing transfer • Manage project timelines, budgets, and resources for test development programs • Lead and develop a team of test and packaging engineers • Collaborate with cross-functional stakeholders (R&D, operations, quality, and supply chain) to ensure alignment on product qualification milestones • Provide technical guidance on packaging and test integration challenges specific to silicon photonics devices