lumilens - Component Process Engineer

• B.S. or M.S. in Material, Chemistry or Mechanical Engineering. • 8+ years of working experience in FR4 substrate or PCB development or manufacturing, with in-depth knowledge in mSAP process, Any-Layer HDI process, for high-speed optical transceiver applications. Must be very familiar with all the equipment, typical materials and the typical process capabilities. • Familiar with PCB layout tools such as Cadence, mechanical design tools such as Solidworks, statistical tools such as JMP. • Working knowledge of PCB test methodologies. • Familiar with FMEA, Control Plan, SPC, 8D, etc. • Fluency in English to communicate with English speaking stakeholders. • 30~50% travel in Asian countries. • M.S. in Electrical or Manufacturing Engineering • Experience with optical transceiver manufacturing process such as SMT, die attach, wire bonding and active alignment. • Six Sigma, Statistical Analysis skills.