Vinci - Principal Thermal Solutions Engineer

Remote - Taiwan3w ago

Remote Principal APAC Semiconductors Solutions Engineer Principal Mandarin Team Leadership Account Management Prospecting Customer Onboarding

Requirements

• Education: Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field. • Education: • Technical depth: Expert-level mastery of commercial simulation software (Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent), with 15+ years of hands-on experience in thermal management and cooling solutions, either as a practitioner running simulations or as a technical account manager for commercial physics simulation software. • Technical depth: • Industry domain: Deep familiarity with semiconductor electronics packaging, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems. • Industry domain: • Customer engagement: Prior experience in dedicated customer-facing roles, with a strong ability to build trust and manage engineering client relationships. • Customer engagement: • Automation & scripting: Practical programming experience using Python or C++ to automate workflows or parse simulation data. • Automation & scripting: • Leadership impact: Proven track record of prior managerial or technical leadership experience, with the ability to scale, mentor, and drive execution across engineering teams. • Leadership impact: • Communication: Elite interpersonal and communication skills, with a proven ability to distill complex physics and simulation results into clear, high-impact narratives for both deep technical panels and business-oriented executives. • Communication: • Language: Professional fluency in Mandarin or Korean. • Language: • Preferred (Desirable Differentiators) • Multiphysics breadth: Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows. • Multiphysics breadth: • Commercial track record: Direct experience commercializing technical software, ideally electronic design automation (EDA) or CAE simulation tools, into major semiconductor and electronics enterprises. • Commercial track record: • Go-to-market experience: Prior experience within technical pre-sales, application engineering (FAE), or strategic technical sales environments. • Emerging tech adjacency: Ability to rapidly adopt and champion next-generation, physics-based workflows and AI-assisted design or simulation tools. • Emerging tech adjacency:

Responsibilities

• Build, lead, and scale a high-performing team of thermal engineers, setting the technical direction, hiring, mentoring team members, and driving field execution across Asia. • Collaborate closely with the sales team to lead technical discussions, scope proof-of-concept (PoC) evaluations, and deliver compelling product demonstrations to prospective enterprise customers. • Guide customer engineering teams through the evaluation phase by overseeing simulation setup, running complex test cases, and interpreting results to explicitly prove Vinci's technical and business value. • Own customer enablement through onboarding, deployment pipeline, and account expansion, providing senior technical guidance, structured training sessions, and advanced troubleshooting. • Provide product guidance and feedback, identify customer pain points and workflow bottlenecks, and partner directly with internal product and engineering teams to transform field feedback into critical new product features. • Represent Vinci at major industry conferences and semiconductor events, engaging technically with key prospects and partners through technical presentations and live platform demonstrations. • Maintain a strong understanding of competitive technologies, industry trends, and market positioning to communicate Vinci's differentiators effectively.

Benefits

• Don't just use AI; help redefine how next-generation hardware is designed. • Work at the convergence of state-of-the-art AI models, fundamental physics, and high-stakes enterprise engineering. • Collaborate with world-class engineers and researchers in a fast-moving startup environment.