• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• 0–5 years of experience in physical design for advanced technology nodes (e.g., 7nm, 5nm, or below), including internships.
• Familiarity with EDA tools for place & route, STA, and sign-off.
• Basic understanding of CMOS technology, semiconductor physics, and process limitations.
• Exposure to timing closure, signal integrity, IR drop analysis, and formal verification.
• Proficiency in scripting languages like TCL, Perl, or Python for automation is a plus.
• Excellent problem-solving skills, communication, and teamwork in a collaborative design environment.
• Interest in working with advanced AI tools and models as part of the design workflow.
• Experience or coursework in high-performance computing (HPC), AI accelerators, or networking chips is a plus.